包装-封装-封装组件-套装软件  pack; OVP

扁平封装装置  flat pack assembler

垂直表面安装封装  VRMLvertical surface mount package; VSB backplanevertical surface mount package; VSIPvertical surface mount package

倒装封装  Flip-chip

封装装置  packaging hardware; packaging system

高密度封装  high density packages; high density packing; high density packaging; High densitypackage; high density package

高密度封装-高密度组装  hid; HDL

密封封装  hermetic package

热封强度  heatsealing strength; heat seal strength; heat-sealing intensity; heat-sealing strength

填埋场封场  Closure of landfill site

芯片尺度封装  Chip scale packaging; CSP

准密封封装  quasi-hermetic package

包装强度  packaging intensity

半导体雷射远场强度分布  laser; far field intensity distribution of semiconductor

崩溃场强度  breakdown field strength

表面电场强度  electric field strength on conductor surface; Surface electric field

波场强度  wave field strength

场强[度]  field strength

场强度  field strength; field strenght; field intensity; field intensity field strength; field intensity [= field strength; FI; STRENGTH; Field; Intensity