标准晶片级加速寿命试验  boundary element analysis

多晶准晶材料  polycrystalline quasicrystal

发光二极体晶片、晶粒  LED Chips not for Communication; LED Chips for Communication

晶片间调平  die-by-die leveling

晶片间倾斜转动  die-by-die tilting

粒间-晶间孔隙度  intergranular-intercrystalline porosity

全晶间片状的  holocrystalline interstitial

氧化物对准晶体管工艺  oat; oxide aligned transistor technology

标线片对准  reticle alignment

步进式芯片对准  die by die alignment

换向片片间试验  bar-to-bar test

经由标线片对准  through-the-reticle alignment

时间片间隔  time slice interval

微硅片对准  micro-silicon-fixer

整片对准  full wafer alignment

整片对准器  full wafer aligner

层间对准  interlevel alignment; level to level alignment

空间对准  Space alignment

时间对准  time-zero; time registration; Time alignment; Time-alignment; time aligning