低外形细节距球栅阵列堆叠芯片
Stacked-Die Low-Profile Fine-Pitch BGA
超薄型IC封装技术
packaging for ultra-thin ICs
叠层3D封装技术
stacked 3D packaging technology
多芯片封装技术
multi-chip packaging(MCP) technology
MEMS封装技术
MEMS packaging technology
微电子封装技术
microelectronics packaging technology
晶圆级薄膜封装技术
wafer-lever thin-film packaging technique
面阵列芯片封装互连
Planar array chip packaging interconnecting